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전기전자공학

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• 제휴몰 주문 시 고객보상, 일부 이벤트 참여 및 증정품 증정, 하루/당일 배송에서 제외되므로 참고 바랍니다.

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• 도서  > 전공도서/대학교재  > 공학계열  > 전기전자공학

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• 이 책은 반도체 패키지와 테스트의 입문서입니다. 반도체 업계에 입문하려는 학생들에게는 방향을 제시하는 지침서의 역할을 하 게 될 것입니다. 또한 패키지와 테스트 관련 업무에 종사하는 분들과 유관 업무를 하고 계신 분 들에게는 이해도를 향상시켜드리게 될 것입니다. 나아가 패키지, 테스트의 장비와 소재를 만드는 분들에게도 이 책의 지식들이 해 당 업무의 효율을 높이는 데 기여할 것이라 생각됩니다. 제1장에서는 테스트 장비와 프로세스, 대략적인 테스트 항목에 대해 설명하였고, 제2장에서는 패키지의 정의와 역할, 기술 개발 트렌드, 기술 개발 프로세스 등을 설 명하였습니다. 제3장에서는 패키지의 종류를 분류하고, 각 종류별 특징, 장단점 등을 기술하였습니다. 제4장에서는 패키지 설계와 해석을 설명하였는데, 패키지 설계와 칩 설계의 차이점을 알리고, 설계 및 공정 효율을 높이기 위한 구조, 열, 전기 해석 내용과 과정 을 소개하였습니다. 제5장은 패키지 공정을 설명하는 장인데, 종류별 공정 순서와 각 공정들의 진행방 법과 의미를 소개하였습니다. 제6장에서는 패키지 공정 진행을 위해서 사용되는 재료들을 소개하였고, 제7장에서는 품질과 신뢰성의 의미 및 신뢰성 평가 항목들의 진행 방법과 목적을 설명하였습니다.
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• 01 반도체 테스트의 이해 01. 반도체 후공정 ······················································ 5 02. 테스트의 종류······················································ 8 03. 웨이퍼 테스트 ···················································· 10 EPM ································································ 13 웨이퍼 번인······················································· 13 테스트 ····························································· 14 리페어······························································ 15 04. 패키지 테스트 ···················································· 16 TDBI································································ 17 테스트 ····························································· 18 외관 검사·························································· 18 02 반도체 패키지의 정의와 역할 01. 반도체 패키지의 정의········································· 25 02. 반도체 ...패키지의 역할 ········································ 26 03. 반도체 패키지의 개발 트렌드····························· 28 04. 반도체 패키지 개발 과정 ··································· 31 03 반도체 패키지의 종류 01. 반도체 패키지의 분류······················································ 39 02. 컨벤셔널 패키지·······························································41 플라스틱 패키지 - 리드프레임 타입 패키지··························41 플라스틱 패키지 - 서브스트레이트 타입 패키지 ·················· 43 세라믹 패키지 ································································ 46 03. 웨이퍼 레벨 패키지························································· 47 웨이퍼 레벨 패키지 ························································· 47 재배선··········································································· 56 플립 칩·········································································· 58 04. 적층 패키지····································································· 66 패키지 적층 ··································································· 67 칩 적층 - Chip Stack with Wire Bonding··························· 70 실리콘 관통 전극 - Chip Stack with TSV ··························· 73 05. 시스템 인 패키지····························································· 86 04 반도체 패키지 설계와 해석 01. 반도체 패키지 설계 ························································· 97 02. 구조 해석······································································· 101 휨 해석········································································ 104 솔더 접합부 신뢰성 ······················································· 106 강도 해석····································································· 108 03. 열 해석 ·········································································· 109 04. 전기 해석 ······································································113 05 반도체 패키지 공정 01. 컨벤셔널 패키지 공정·······································123 백 그라인딩 ····················································124 웨이퍼 절단·····················································127 다이 어태치 ····················································131 인터커넥션······················································137 몰딩·······························································143 마킹·······························································144 트리밍 - 리드프레임·········································146 솔더 도금 - 리드프레임·····································147 성형 - 리드프레임············································147 솔더 볼 마운팅 - 서브스트레이트 ·······················148 싱귤레이션 - 서브스트레이트 ····························152 02. 웨이퍼 레벨 패키지 공정··································153 포토 공정 ·······················································156 스퍼터링 공정 ················································· 161 전해도금 공정 ·················································163 습식 공정 - PR 스트립과 금속 에칭 ····················166 팬인 WLCSP 공정············································167 솔더 볼 마운팅 공정·········································168 플립 칩 범프 공정 ············································169 재배선 공정 ····················································171 팬아웃 WLCSP 공정·········································172 실리콘 관통 전극 패키지 공정···························· 174 03. 검사와 측정······················································187 검사·······························································187 측정·······························································192 06 반도체 패키지 재료 01. 컨벤셔널 패키지 재료···················································· 208 리드프레임 ·································································· 208 서브스트레이트···························································· 210 접착제········································································· 217 에폭시 몰딩 컴파운드···················································· 222 솔더 ··········································································· 225 테이프········································································· 228 와이어 ········································································ 229 포장 재료 ···································································· 230 02. 웨이퍼 레벨 패키지 재료··············································· 231 포토 레지스트 ······························································ 231 도금 용액····································································· 234 PR 스트립퍼································································· 235 에천트········································································· 237 스퍼터 타깃 ································································· 238 언더필········································································· 238 캐리어와 접착제, 마운팅 테이프······································ 240 07 반도체 패키지 신뢰성 01. 신뢰성 의미 ··································································· 247 02. JEDEC 기준··································································· 248 03. 수명 신뢰성 시험··························································· 253 EFR ············································································ 253 HTOL ········································································· 254 LTOL ·········································································· 255 HTSL ·········································································· 256 LTSL··········································································· 257 Endurance ····················································· 257 Data Retention··············································· 258 04. 환경 신뢰성 시험·············································· 259 Preconditioning·············································· 259 TC ································································· 263 TS ································································· 268 THS······························································· 268 PCTP······························································269 UHAST ·························································· 270 HAST····························································· 271 HALT····························································· 272 05. 기계적 신뢰성 시험·········································· 273 충격································································274 진동······························································· 275 구부림 ··························································· 275 비틀림·····························································276 08 반도체 용어해설 용어해설·································································· 282
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• 서민석 [저]

• 한국과학기술원 재료공학과에서 학사,석사 학위를 취득하였고, 반도체 패키지를 위한 전해 도금 공정 및 재료 연구로 박사학위를 취득하였다.
  
  이후 SK하이닉스 반도체에서 SRAM & Flash 공정 개발에 참여하였다가 2003년부터 반도체 패키지 개발 부서에서 RDL, Flip Chip, Fan in WLCSP, TSV(HBM, 3DS, Wide IO)등의 Wafer Level Package 개발을 주관하였다.

• 전체 0개의 구매후기가 있습니다.
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인터파크도서는 고객님의 단순 변심에 의한 교환과 반품에 드는 비용은 고객님이 지불케 됩니다. 단, 상품이나 서비스 자체의 하자로 인한 교환 및 반품은 무료로 반품 됩니다. 교환 및 반품이 가능한 경우 상품을 공급 받은 날로부터 7일이내 가능 공급받으신 상품의 내용이 표시, 광고 내용과 다르거나 다르게 이행된 경우에는 공급받은 날로부터 3개월 이내,    혹은 그사실을 알게 된 날 또는 알 수 있었던 날로부터 30일 이내 상품에 아무런 하자가 없는 경우 소비자의 고객변심에 의한 교환은 상품의 포장상태 등이 전혀 손상되지 않은 경우에 한하여 가능 교환 및 반품이 불가능한 경우 구매확정 이후(오픈마켓상품에 한함) 고객님의 책임 있는 사유로 상품 등이 멸실 또는 훼손된 경우    (단, 상품의 내용을 확인하기 위하여 포장 등을 훼손한 경우는 제외) 시간이 지남에 따라 재판매가 곤란할 정도로 물품의 가치가 떨어진 경우 포장 개봉되어 상품 가치가 훼손된 경우 다배송지의 경우 반품 환불 다배송지의 경우 다른 지역의 반품을 동시에 진행할 수 없습니다. 1개 지역의 반품이 완료된 후 다른 지역 반품을 진행할 수 있으므로, 이점 양해해 주시기 바랍니다. 중고상품의 교환 중고상품은 제한된 재고 내에서 판매가 이루어지므로, 교환은 불가능합니다. 오픈마켓 상품의 환불 오픈마켓상품에 대한 책임은 원칙적으로 업체에게 있으므로, 교환/반품 접수시 반드시 판매자와 협의 후 반품 접수를 하셔야하며,    반품접수 없이 반송하거나, 우편으로 보낼 경우 상품 확인이 어려워 환불이 불가능할 수 있으니 유의하시기 바랍니다.

배송예정일 안내 인터파크 도서는 모든 상품에 대해 배송완료예정일을 웹사이트에 표시하고 있습니다. <인터파크 직배송 상품> 상품은 월~토요일 오전 10시 이전 주문분에 대하여 당일 출고/당일 배송완료를 보장하는 상품입니다. 상품은 서울지역/평일 주문분은 당일 출고/익일 배송완료를 보장하며, 서울외지역/평일 주문분의 경우는 오후 6시까지 주문분에 대하여 익일 배송완료를 보장하는 상품입니다. (단, 월요일은 12시까지 주문에 한함) 상품은, 입고예정일(제품출시일)+택배사배송일(1일)에 배송완료를 보장합니다. ~ 상품은 유통특성상 인터파크에서 재고를 보유하지 않은 상품으로 주문일+기준출고일+택배사배송일(1일)에 배송완료를 보장합니다.(토/공휴일은 배송기간에 포함되지 않습니다.) ※기준출고일:인터파크가 상품을 수급하여 물류창고에서 포장/출고하기까지 소요되는 시간 <업체 직접배송/오픈마켓 상품> ~ 상품은 업체가 주문을 확인하고, 출고하기까지 걸리는 시간입니다. 주문일+기준출고일+택배사배송일(2일)에 배송완료를 보장합니다.(토/공휴일은 배송기간에 포함되지 않습니다.) ※5일이내 출고가 시작되지 않을시, 오픈마켓 상품은 자동으로 주문이 취소되며, 고객님께 품절보상금을 지급해 드립니다. 배송비 안내 도서(중고도서 포함)만 구매하시면 : 배송비 2,000원 (1만원이상 구매 시 무료배송) 음반/DVD만 구매하시면 : 배송비 1,500원 (2만원이상 구매 시 무료배송) 잡지/만화/기프트만 구매하시면 : 배송비 2,000원 (2만원이상 구매 시 무료배송) 도서와 음반/DVD를 함께 구매하시면 : 배송비 1,500원 1만원이상 구매 시 무료배송) 도서와 잡지/만화/기프트/중고직배송상품을 함께 구매하시면 : 2,000원 (1만원이상 구매 시 무료배송) 업체직접배송상품을 구매시 : 업체별로 상이한 배송비 적용    * 세트상품의 경우 부분취소 시 추가 배송비가 부과될 수 있습니다.    * 북카트에서 배송비없애기 버튼을 클릭하셔서, 동일업체상품을 조금 더 구매하시면, 배송비를 절약하실 수 있습니다. 해외배송 안내 인터파크도서에서는 국내에서 주문하시거나 해외에서 주문하여 해외로 배송을 원하실 경우 DHL과 특약으로 책정된 요금표에    의해 개인이 이용하는 경우보다 배송요금을 크게 낮추며 DHL(www.dhl.co.kr)로 해외배송 서비스를 제공합니다. 해외배송은 도서/CD/DVD 상품에 한해 서비스하고 있으며, 다른 상품을 북카트에 함께 담으실 경우 해외배송이 불가합니다. 해외주문배송 서비스는 인터파크 도서 회원 가입을 하셔야만 신청 가능합니다. 알아두세요!!! 도매상 및 제작사 사정에 따라 품절/절판 등의 사유로 취소될 수 있습니다. 오픈마켓업체의 배송지연시 주문이 자동으로 취소될 수 있습니다. 출고가능 시간이 서로 다른 상품을 함께 주문할 경우 출고가능 시간이 가장 긴 기준으로 배송됩니다. 유통의 특성상 출고기간은 예정보다 앞당겨지거나 늦춰질 수 있습니다. 택배사 배송일인 서울 및 수도권은 1~2일, 지방은 2~3일, 도서, 산간, 군부대는 3일 이상의 시간이 소요됩니다.